Wednesday, February 4, 2026

TOPPAN Digital to Showcase NFC Packaging at Paris Packaging Week 2026

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TOPPAN Digital will present its NFC-enabled smart packaging and ID authentication solutions at Paris Packaging Week 2026 in Paris, France, focusing on brand protection, supply chain traceability, and connected packaging for premium products.

The Tokyo-based company, part of TOPPAN Holdings, will exhibit in the PLD area on February 5–6 at Paris Expo Porte de Versailles. The showcase targets luxury beverages, fragrance, and beauty brands facing rising pressure around counterfeiting, grey market diversion, and digital engagement.

The move highlights growing momentum in the France packaging market, while also reflecting broader innovation trends coming from Japan packaging suppliers, who continue to lead development in connected labels, authentication technology, and smart packaging platforms.

At the event, TOPPAN Digital will demonstrate secure NFC tags with opening detection functions. These tags are designed to identify when packaging has been tampered with and help prevent fraudulent refilling, a growing issue in premium wine, spirits, and fragrance categories.

The company will also present its cloud-based ID authentication platform. By assigning unique digital identifiers to individual products, the system enables full product-level traceability from production to point of sale. This allows brands to monitor distribution routes, detect grey market activity, and improve supply chain visibility.

Another focus area is consumer engagement. NFC-enabled packaging allows brands to deliver digital content directly to shoppers via smartphone scans, creating interactive brand experiences before and after product opening.

TOPPAN Digital will additionally showcase specialised NFC formats, including LED-enabled tags for visual interaction, on-metal NFC tags for metal containers, and ultra-small tags suited for compact beauty packaging formats such as cosmetics and personal care items.

During Paris Packaging Week, TOPPAN Group’s Selinko platform will also participate in a panel discussion on connected packaging and data integration. The session will explore how NFC-enabled packaging can support AI-driven data collection across the product lifecycle, helping brands improve decision-making and operational efficiency.

The company says demand for item-level authentication and digital packaging solutions is increasing as premium brands seek stronger protection against counterfeit goods while improving transparency across complex international supply chains.

With connected packaging becoming a core tool for brand protection and regulatory readiness, TOPPAN Digital’s Paris showcase signals continued investment in smart packaging systems across Europe’s packaging sector in 2026.

Editor’s Note: This article is based on TOPPAN Digital’s official Paris Packaging Week 2026 announcement. Event details and technology descriptions reflect information released by the company at the time of publication.